Plastics Decorating



High-Tech Contract Decorating at Emerald Corporation

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2012 SGIA Expo Show Preview

Ask the Expert
Plastics Surface Energy Wetting Test Methods

Scratch-resistant in One Step

Letter from the Chair
TopCon Rolls Through Indy
Digital Decorating Webinar Scheduled for August 28

Ultrasonic Welding: The Need for Speed Control

How to Close Sales that are Over the Budget


February 12-14
PLASTEC West, Anaheim Convention Center, Anaheim, CA,

March 19
Plastics Crossroads Summit, Sheraton Hotel, Anaheim, CA,

March 20-21
PLASTEC South, Orange County Convention Center, Orlando, FL,

April 8
AWA DecTec USA, Orange County Convention Center, Orlando, FL,

April 22-24
SPE ANTEC® 2013, Duke Energy Convention Center, Cincinnati, OH,

June 18-20
HBA, June 18-20, Jacob K. Javits Convention Center, New York City, NY,

June 18-20
PLASTEC East, , Pennsylvania Convention Center, Philadelphia, PA,


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Plastics Decorating Magazine 
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IMLCON, IMDCON Set for Oct. 4-5 in Chicago


For 20 years, the IMLCON™ and IMDCON™ Conference and Exhibition has been the only international event dedicated to the in-mold industry. Material suppliers, converters, machine producers, technology suppliers and brand owners once again will converge on Oct. 4-5 in Chicago for the annual event. The formal conference agenda features a program of expert papers focusing on two areas: Market and Technology Trends and In-mold Technology Challenges and Opportunities.

Presentations focusing on trends include Clare Goldberry, of Modern Plastics Worldwide, addressing IML and IMD in the mainstream packaging and product decoration markets; Corey M. Reardon, president and CEO of AWA Alexander Watson Associates, providing an overview of the IML market; Eric Irwin, product design engineer with Boa Technology Inc., briefing the attendees about a project for the sporting industry; Laura Bix, of Michigan State University’s School of Packaging, discussing the interaction between packaging and the consumer; and Tickety Boo’s Mark Shayler and PwC’s Ian Murdoch both speaking on aspects of the eco-friendly movement.

Presentations about challenges and opportunities include Mark Dirr, XTEN Industries, on the IML/IMD odyssey; Stephen Boyd, Systems Labeling, introducing a recent breakthrough in removable in-mold labels; Keith Bechard, Entropex, demonstrating the value of removable labels in the recycling arena; Jes Gram, Gram Technology, showing how thin wall and barrier applications justify the use of technology in new product areas; and Clayton Simpson, Cyan Tec, speaking on competitive technology, direct-to-product inkjet and its likely future in product identification and decoration.

Completing the program are a panel discussion, networking breaks, visits to the exhibition and a cocktail reception sponsored by Marbach.

Other event sponsors are Eastman, Illig and Yupo, and industry media including Converting Quarterly, Label & Narrow Web, PFFC, Plastics Decorating and Plastics Today.

For more information and to register for the conference, visit